Name: Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry
Brand: WINNER
Price: 999 USD

Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

Brand Name : WINNER

Model Number : WNE T9

Certification : ISO9100

Place of Origin : CHINA

MOQ : 1PC

Price : 999

Payment Terms : L/C, Western Union, T/T Supply Ability

Supply Ability : 100000 rolls per month

Delivery Time : 5-8 WORKING DAYS

Packaging Details : Roll, Neutrial Packing or with OEM LOGO

Diameter : 0.001mm - 0.05mm

Breaking Load BL(gf) : >4

Elongation EL(%) : 3-20

Wire Bonding Type : Ball Bonding, Wedge Bonding, Ribbon Bonding

Material : Copper

Application : Semiconductor, Electronics, Medical Devices

Bonding Method : Ultrasonic

Product Type : Bonding Wire

Wire Diameter : 0.001 inches

Coating Thickness : 0.001mm

Coating : noting

Length Meters : 500/1000

Corrosion Resistance : High

Purity : 99.999%

Temperature Range : -40°C to 200°C

Surface Finish : Bright

Conductivity : 98%

Package Size : 100 meters

Bond Strength : High

Package : Spool

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Superior Aluminum Bonding Wire for Precision Bonding in Microelectronics and Power Semiconductor Industry

In the fast - evolving microelectronics power semiconductor industry, our Superior Al Wire Bonding solution stands out.

Made from high - quality aluminum, our wire exhibits outstanding performance. Aluminum's excellent electrical conductivity ensures efficient power transfer, which is vital for power semiconductor applications. It allows for rapid and accurate signal transmission, reducing power losses and enhancing overall device efficiency.

Precision is the key feature of our product. The wire is designed to achieve micron - level bonding accuracy, meeting the stringent requirements of microelectronics. This high - precision bonding ensures reliable connections in even the most complex power semiconductor circuits. Whether for high - power integrated circuits or miniaturized power modules, our Al wire bonding solution provides consistent and stable performance, enabling the development of more advanced and reliable microelectronic devices.

Al Wire for Power
Type	Ø Diameter (μm)	Breaking Load BL(gf)	Elongation EL(%)	Length Meters
WNE T1	100±5	50~100	10~30	500/1000/2000
	125±5	60~120	10~30	500/1000/2000
	150±5	100~200	10~30	500/1000/2000
	170±5	140~240	10~30	500/1000/2000
	200±7	150~250	10~30	500/1000/2000

Bonded aluminum wire applications:

*Automotive electronics

*Consumer electronics

*Computing equipment

*Chip on board (COB) technology

*Bonding of discrete components (diodes, transistors, capacitors, resistors)

*Bonding of hybrid components

Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

1.What kind of Enameled copper wire do Winner produce?

We focus on research and development of selfbonding magnet round copper wire, fine polyurethane magnet wire, selfbonding litz copper wire and selfbonding silk covered wire.

2.What's diameters available of the Enamelled copper wire ?

We specialize in fine and ultra fine enamelled copper wire,diameters available of our products is Φ0.018-0.50mm.

3.What's selfbonding enameled copper wire?

Selfbonding enamelled copper wire is a special type of enamelled wire with an additional adhesive enamel overcoat such as thermoplastic resin.This adhesive has a bonding feature, which is activated

by heat or solvents.

Once activated the adhesive bonds turn to turn windings into a compact self supporting coil.

The use of selfbonding wire may offer cost and manufacturing advantages in some winding applications

as bobbins, tape, varnishing, or impregnation may be eliminated.

4. Is possible to get any sample of selfbonding enamelled copper wire that you have in production?

Of course you can!

Superior Al Wire Bonding For Precision Bonding In Microelectronics Power Semiconductor Industry

Product Tags:

Aluminum bondable wire